B-staged epoxy is less well known than the widely available two-part liquid epoxies, but it is an important form of epoxy that should be considered in many applications. A distinguishing feature of b-stage epoxy is that it requires heat to cure, typically between 120 and 150°C, but for some products as low as 90°C. While this may be a disadvantage in some applications, for others it is a distinct opportunity in that work life is significantly longer and total cure time is substantially reduced.
B-stage epoxy is available as a liquid (one-part) and, more commonly, as a dry, solid film. The film format is most widely used for large area applications (such as printed wiring boards) or complex bond areas that have many openings. In both cases, epoxy film enables very uniform bond line thickness. More information can be found on the downloadable overview below.
We have an excellent selection of b-stage epoxy film. Descriptions and data sheets are available here
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